In brief it is a pcb producing methodology that spreads decoupled capacitance by inserting them in tiny dielectric layers inside the pcb and next to the power areas. The zbc 2000 laminate is constructed using a single ply of either 106 or 6060 style prepreg yielding a dielectric thickness after lamination of 0 002 0 0005 inches when measured by cross sectioning. Approved zbc 2000 substrate available for thinner more reliable assemblies and increased board densities proprietary advanced resin technology industry standard material with well documented dielectric constant and loss tangent properties high tg fr 4 processing identical processing to the nelco n4000 13 similar to traditional high.
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